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 IRF9130SMD
MECHANICAL DATA Dimensions in mm (inches)
0 .8 9 (0 .0 3 5 ) m in . 3 .7 0 (0 .1 4 6 ) 3 .7 0 (0 .1 4 6 ) 3 .4 1 (0 .1 3 4 ) 3 .4 1 (0 .1 3 4 ) 4 .1 4 (0 .1 6 3 ) 3 .8 4 (0 .1 5 1 )
3 .6 0 (0 .1 4 2 ) M ax.
P-CHANNEL POWER MOSFET FOR HI-REL APPLICATIONS
VDSS ID(cont) RDS(on)
FEATURES
1
3
1 0 .6 9 (0 .4 2 1 ) 1 0 .3 9 (0 .4 0 9 )
2
-100V -8A W 0.35W
0 .7 6 (0 .0 3 0 ) m in .
9 .6 9 .3 1 1 .5 1 1 .2
7 (0 8 (0 8 (0 8 (0
.3 8 .3 6 .4 5 .4 4
1)
9) 6) 4)
1 6 .0 2 (0 .6 3 1 ) 1 5 .7 3 (0 .6 1 9 )
0 .5 0 (0 .0 2 0 ) 0 .2 6 (0 .0 1 0 )
* HERMETICALLY SEALED * SIMPLE DRIVE REQUIREMENTS * LIGHTWEIGHT * SCREENING OPTIONS AVAILABLE
SMD 1
Pad 1 - Gate Pad 2 - Drain Pad 3 - Source
* ALL LEADS ISOLATED FROM CASE
(also available as IRFN9130SMD with Gate and Source reversed)
ABSOLUTE MAXIMUM RATINGS (Tcase = 25C unless otherwise stated)
VGS ID ID IDM PD TJ , Tstg RqJC Gate - Source Voltage Continuous Drain Current @ Tcase = 25C Continuous Drain Current @ Tcase = 100C Pulsed Drain Current Power Dissipation @ Tcase = 25C Linear Derating Factor Operating and Storage Temperature Range Thermal Resistance Junction to Case 20V 8A 5A 40A 45W 0.36W/C -55 to 150C 2.8C/W max.
Semelab plc.
Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612. E-mail: sales@semelab.co.uk Website http://www.semelab.co.uk
Prelim. 09/00
IRF9130SMD
ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise stated)
Parameter
BVDSS STATIC ELECTRICAL RATINGS Drain - Source Breakdown Voltage
Test Conditions
VGS = 0 ID = 1mA VGS = 10V VGS = 10V VDS = VGS VDS 15V VGS = 0 VGS = 20V VGS = -20V VGS = 0 VDS = 25V f = 1MHz VGS = 10V VDS = 0.5BVDSS ID = 8A VDS = 0.5BVDSS VDD = 50V ID = 8A RG = 7.5W ID = 8A ID = 5A ID = 8A ID = 250mA IDS = 5A VDS = 0.8BVDSS TJ = 125C ID = 1mA
Min.
100
Typ.
Max.
Unit
V
DBVDSS Temperature Coefficient of DTJ Breakdown Voltage
RDS(on) Static Drain - Source On-State Resistance Forward Transconductance Zero Gate Voltage Drain Current Forward Gate - Source Leakage Reverse Gate - Source Leakage DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate - Source Charge Gate - Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time
Reference to 25C
0.1 0.35 0.4 2 3 25 250 100 -100 860 350 125 12.5 1.0 2 29 6.3 27 60 140 140 140 8 32 4
V / C
W
V S(W )W(
VGS(th) Gate Threshold Voltage gfs IDSS IGSS IGSS Ciss Coss Crss Qg Qgs Qgd td(on) tr td(off) tf IS ISM VSD trr Qrr LD LS
mA
nA
pF
nC nC
ns
SOURCE - DRAIN DIODE CHARACTERISTICS Continuous Source Current Pulse Source Current Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge PACKAGE CHARACTERISTICS Internal Drain Inductance Internal Source Inductance IS = 8A VGS = 0 IS = 8A TJ = 25C di / dt 100A/ms VDD 50V
(from 6mm down drain lead pad to centre of die)
A V ns
TJ = 25C
4.7 300 3 8.7 8.7
mC
nH
(from 6mm down source lead to centre of source bond pad)
Semelab plc.
Telephone +44(0)1455) 556565. Fax +44(0)1455) 552612. E-mail: sales@semelab.co.uk Website http://www.semelab.co.uk
Prelim. 09/00


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